Thermal Metrology for Materials and Architectures

Thermal metrology instruments that
directly measure how heat moves
through materials and architectures.

The thermal properties driving this may not match the assumptions, supplier data, or simulations you’ve been working from. And the tools available to you weren’t built to close that gap. Not at this length scale. Not in this architecture. Not close enough to the actual application to trust the result.

Not to replace the tools that work. To do the measurements no other tool was designed for:

You’re not only looking for a characterization tool.
You’re looking for the materials thermal intelligence to see what’s actually governing the thermal behavior of your material or device.

Whether you recognize your technology or the thermal challenge you’re facing, start where it feels most familiar. We’ll guide you to the relevant expertise, measurement capabilities, and solutions.

Recognize your technology. Find the materials, devices, and architectures where Laser Thermal helps engineers answer difficult thermal characterization questions.

Semiconductor
Thin films, advanced packaging, 3D integration, power devices, and wafer-level thermal characterization.

Advanced Materials
Novel materials, thermal interface materials, ceramics, polymers, composites, and functional materials.

Electronics Packaging
Packages, die attach, TIMs, substrates, and thermal performance across assembled electronic systems.

Aerospace & Defense
Coatings, composites, propulsion materials, lightweight structures, and extreme-environment applications.

Research & Academia
Measurement platforms for fundamental thermal transport research, materials science, and engineering innovation.

Recognize your engineering problem. Discover the thermal behaviors, material systems, and measurement challenges that conventional techniques often struggle to characterize.

Thin Films & Multilayer Structures
Measure thermal transport through thin films, coatings, multilayer stacks, and buried layers.

Thermal Interfaces
Separate interface resistance from bulk material properties across bonded layers, die attach, and thermal interface materials.

Anisotropic Materials
Characterize heat flow in materials whose thermal conductivity changes with direction.

Process-Induced Variability
Understand how deposition, growth, curing, sintering, additive manufacturing, and other processes change thermal behavior.

Localized Thermal Behavior
Reveal thermal variations, hot spots, defects, and non-uniformity through spatially resolved measurements.

Cutting-edge instrumentation, precise and advanced measurements, automated operation and analysis,
for materials and interfaces at the nano, micro, and macro scales

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Thermal properties measurements & thermal property imaging from ultra thin-film to bulk materials. Explore FASTR

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Thermal conductivity measurements for solids, liquids, pastes, gels, and foams. Explore TOPS

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Accelerate your R&D and gain a competitive edge with our full-service thermal characterization testing laboratory. From advanced materials and thin films to solids and liquids, we provide rapid testing, use non-destructive methods and deliver precise measurements.

Our expert team and state-of-the-art instruments offer testing solutions, whether on a project basis or through bundled support packages.

Today’s performance limits increasingly live in architectures, where films are thinner, conductivities are higher, interfaces are buried, and heat flows differently by direction. Laser Thermal measures heat transport where it actually happens, at the right length scale and on the real sample. And it delivers results at the speed your progress demands.

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Automated workflows remove the operator-dependent variables that make thermal data hard to defend, and measurement techniques designed for difficult materials capture what conventional approaches can miss. Engineering teams get results they can trust, and leadership gets the confidence to move projects forward.

accelerate speed fast

Automation makes thermal characterization a routine step rather than a queue. Answers arrive while design choices are still open, reducing the time spent investigating unexpected performance or redesigning around incorrect assumptions.

When you can see what actually governs thermal performance, you can optimize the materials and processes others are still approximating, reduce technical risk, and bring differentiated products to market.

Our Clients Include Industry, Academia, and Government.

The logos below are only those we’re able to share publicly. Our broader customer base includes many of the leading semiconductor labs, national research laboratories, and power electronics manufacturers driving the industry forward.

Logo customer Broadcom
Logo customer NIST
Logo customer imec
Logo customer Louisiana Tech
Logo customer AFRL
Logo customer University of Wisconsin Milwaukee
Logo customer Sandia
Logo customer URI Logo 282
Logo customer University-of-Maryland
Logo customer Oak Ridge National Lab
Logo customer Sealy

New from Our Learning Center

Overcoming Challenges in Thermal Conductivity Measurement, from Soft TIMs to CVD Diamond
Webinar

Overcoming Challenges in Thermal Conductivity Measurement, from Soft TIMs to CVD Diamond

September 29, 2026
Thermal characterization matters more as AI accelerators intensify an existing package-level bottleneck
Thermal Insights

Thermal characterization matters more as AI accelerators intensify an existing package-level bottleneck

September 21, 2026 John Gaskins
Five Key Challenges for Increasing U.S. Domestic Semiconductor Manufacturing Capacity
Guides

Five Key Challenges for Increasing U.S. Domestic Semiconductor Manufacturing Capacity

September 15, 2026 John Gaskins
What is Thermoreflectance?
Thermal Basics

What is Thermoreflectance?

July 23, 2026 Dr. Patrick Hopkins
Overcoming Challenges in Thermal Property Measurement and Imaging of TIMs
Webinar

Overcoming Challenges in Thermal Property Measurement and Imaging of TIMs

May 19, 2026 Jeff Braun
Thermal Measurements for Emerging Materials – State-of-the-art measurements for thin films, TIMs, and high-temperature materials
Webinar

Thermal Measurements for Emerging Materials – State-of-the-art measurements for thin films, TIMs, and high-temperature materials

May 14, 2026 Physics Today
Heat Beneath the Surface: Thermal Metrology for Advanced Semiconductor Materials and Architectures
Guides

Heat Beneath the Surface: Thermal Metrology for Advanced Semiconductor Materials and Architectures

April 14, 2026 John Gaskins
Unveiling Phonon Contributions to Thermal Conductivity and the Applicability of the Wiedemann–Franz Law in Ruthenium and Tungsten Thin Films.
RESEARCH PUBLICATIONS

Unveiling Phonon Contributions to Thermal Conductivity and the Applicability of the Wiedemann–Franz Law in Ruthenium and Tungsten Thin Films.

September 18, 2025 Adv. Funct. Materials
A thermo-optical plane source method to measure thermal conductivity
RESEARCH PUBLICATIONS

A thermo-optical plane source method to measure thermal conductivity

June 4, 2025 Rev. Sci. Instrum.
Limitations and Advances in Optical Thermal Transport Measurements: Extremes in Properties, Length Scales, and Temperature
RESEARCH PUBLICATIONS

Limitations and Advances in Optical Thermal Transport Measurements: Extremes in Properties, Length Scales, and Temperature

April 27, 2025 Ann. Rev. Mat. Res.
Characterization of AlF3-Passivated Aluminum Mirrors using non-contact thermal metrology
RESEARCH PUBLICATIONS

Characterization of AlF3-Passivated Aluminum Mirrors using non-contact thermal metrology

February 4, 2025 Re. Sci. Instrum.
Thermal Conductivity
Thermal Basics

Thermal Conductivity

July 24, 2024 Dr. Patrick Hopkins
Thermal Resistance
THERMAL BASICS

Thermal Resistance

May 2, 2024 Dr. Patrick Hopkins
Specific Heat, Volumetric Heat Capacity, and Thermal Diffusivity
THERMAL BASICS

Specific Heat, Volumetric Heat Capacity, and Thermal Diffusivity

April 4, 2024 Dr. Patrick Hopkins
Introduction to Thermal Metrology
THERMAL BASICS

Introduction to Thermal Metrology

March 27, 2024 Patrick Hopkins
High Thermal Conductivity and Thermal Boundary Conductance of Homoepitaxially Grown Gallium Nitride (GaN) Thin Films
RESEARCH PUBLICATIONS

High Thermal Conductivity and Thermal Boundary Conductance of Homoepitaxially Grown Gallium Nitride (GaN) Thin Films

October 14, 2021 Phys. Rev. Materials
Thermal Conductivity Measurements of Sub-Surface Buried Substrates by Steady-State Thermoreflectance
RESEARCH PUBLICATIONS

Thermal Conductivity Measurements of Sub-Surface Buried Substrates by Steady-State Thermoreflectance

June 19, 2021 Rev. Sci. Instrum.
High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films
RESEARCH PUBLICATIONS

High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films

April 28, 2021 ACS Nano
Spatially Resolved Thermoreflectance Techniques for Thermal Conductivity Measurements from the Nanoscale to the Mesoscale
RESEARCH PUBLICATIONS

Spatially Resolved Thermoreflectance Techniques for Thermal Conductivity Measurements from the Nanoscale to the Mesoscale

October 16, 2019 J. Appl. Phys
A Steady-State Thermoreflectance Method to Measure Thermal Conductivity
RESEARCH PUBLICATIONS

A Steady-State Thermoreflectance Method to Measure Thermal Conductivity

February 28, 2019 Rev. of Sci. Instrum.

We look forward to collaborating with you to understand your specific needs and provide tailored solutions for your project’s success.

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