Thermal Metrology for Materials and Architectures

Measure What Governs Thermal Performance.

Thermal metrology instruments and testing services for thin films,
buried interfaces, bulk solids, liquids, and pastes. Direct
measurements at the scales that matter to your application.

Trusted by leading chipmakers, equipment makers,
materials suppliers, and national laboratories
.

You’ve refined the formulation, optimized the process, or developed an entirely new material. Yet its thermal behavior doesn’t match expectations, published properties, or simulation results.

What happens when the measurements themselves are part of the uncertainty?

Your existing tools still do what they were designed to do. The measurements you need demand a different approach:


High-throughput instrumentation, repeatable measurements, and automated operation and analysis,
for materials and interfaces at the nano, micro, and macro scales.

logo-product-fastr
product-image-fastr

Thermal properties measurements & thermal property imaging from ultrathin films to bulk materials. Explore FASTR

logo-product-tops

Thermal conductivity measurements for solids, liquids, pastes, gels, and foams. Explore TOPS

accent-image-testing

Accelerate your R&D and gain a competitive edge with our full-service thermal characterization testing laboratory. From advanced materials and thin films to solids and liquids, we provide rapid testing, on our high-performance instruments and deliver precise measurements.

Our expert team and state-of-the-art instruments offer testing solutions, whether on a project basis or through bundled support packages.

Explore how to address the requirements of your industry or the thermal challenges you’re working to solve. We’ll guide you to the relevant expertise, measurement capabilities, and solutions.

Today’s performance limits increasingly live in architectures, where films are thinner, conductivities are higher, interfaces are buried, and heat flows differently by direction. Thermal is no longer only a design question. It’s a reliability, schedule, and yield question.

dsicovery

Automated alignment, calibration, and analysis minimize operator-dependent variability. Engineers get repeatable data to validate models and defend decisions. Leadership gets a sound basis for moving the project forward.

Send samples to our lab to compare materials or evaluate a process change, with no capital commitment. When the questions keep coming, bring the same capability in-house and stop waiting on outside queues.

accelerate speed fast

Rapid measurements, automated workflows, and high-throughput characterization bring thermal data into the development process when it matters most. Investigate performance without waiting for lengthy measurement and analysis cycles, and before it turns into a redesign.

The measurement that starts in your R&D lab becomes the process control your production line runs on. Thermal metrology is moving toward near-line and in-line use, and our roadmap is built for that path.


Our Clients Include Industry, Academia, and Government

The logos below are only those we’re able to share publicly. Our broader customer base includes many of the leading chipmakers, equipment makers, materials suppliers, and national laboratories driving their industry forward.

Logo customer Broadcom
Logo customer NIST
Logo customer imec
Logo customer Louisiana Tech
Logo customer AFRL
Logo customer University of Wisconsin Milwaukee
Logo customer Sandia
Logo customer URI Logo 282
Logo customer University-of-Maryland
Logo customer Oak Ridge National Lab
Logo customer Sealy

New from Our Learning Center

Lock-in infrared thermography: Phase analysis for rapid, wide-range thermal conductivity measurements
Research Publications

Lock-in infrared thermography: Phase analysis for rapid, wide-range thermal conductivity measurements

October 19, 2026 Rev. Sci. Instrum.
Overcoming Challenges in Thermal Conductivity Measurement, from Soft TIMs to CVD Diamond
Webinar

Overcoming Challenges in Thermal Conductivity Measurement, from Soft TIMs to CVD Diamond

September 29, 2026 Jeff Braun
Thermal characterization matters more as AI accelerators intensify an existing package-level bottleneck
Thermal Insights

Thermal characterization matters more as AI accelerators intensify an existing package-level bottleneck

September 21, 2026 John Gaskins
Five Key Challenges for Increasing U.S. Domestic Semiconductor Manufacturing Capacity
Guides

Five Key Challenges for Increasing U.S. Domestic Semiconductor Manufacturing Capacity

September 15, 2026 John Gaskins
What is Thermoreflectance?
Thermal Basics

What is Thermoreflectance?

July 23, 2026 Dr. Patrick Hopkins
Overcoming Challenges in Thermal Property Measurement and Imaging of TIMs
Webinar

Overcoming Challenges in Thermal Property Measurement and Imaging of TIMs

May 19, 2026 Jeff Braun
Thermal Measurements for Emerging Materials – State-of-the-art measurements for thin films, TIMs, and high-temperature materials
Webinar

Thermal Measurements for Emerging Materials – State-of-the-art measurements for thin films, TIMs, and high-temperature materials

May 14, 2026 Physics Today
Heat Beneath the Surface: Thermal Metrology for Advanced Semiconductor Materials and Architectures
Guides

Heat Beneath the Surface: Thermal Metrology for Advanced Semiconductor Materials and Architectures

April 14, 2026 John Gaskins
Unveiling Phonon Contributions to Thermal Conductivity and the Applicability of the Wiedemann–Franz Law in Ruthenium and Tungsten Thin Films.
RESEARCH PUBLICATIONS

Unveiling Phonon Contributions to Thermal Conductivity and the Applicability of the Wiedemann–Franz Law in Ruthenium and Tungsten Thin Films.

September 18, 2025 Adv. Funct. Materials
A thermo-optical plane source method to measure thermal conductivity
RESEARCH PUBLICATIONS

A thermo-optical plane source method to measure thermal conductivity

June 4, 2025 Rev. Sci. Instrum.
Limitations and Advances in Optical Thermal Transport Measurements: Extremes in Properties, Length Scales, and Temperature
RESEARCH PUBLICATIONS

Limitations and Advances in Optical Thermal Transport Measurements: Extremes in Properties, Length Scales, and Temperature

April 27, 2025 Annu. Rev. Mater. Res.
Characterization of AlF3-Passivated Aluminum Mirrors using non-contact thermal metrology
RESEARCH PUBLICATIONS

Characterization of AlF3-Passivated Aluminum Mirrors using non-contact thermal metrology

February 4, 2025 Rev. Sci. Instrum.
Thermal Conductivity
Thermal Basics

Thermal Conductivity

July 24, 2024 Dr. Patrick Hopkins
Thermal Resistance
THERMAL BASICS

Thermal Resistance

May 2, 2024 Dr. Patrick Hopkins
Specific Heat, Volumetric Heat Capacity, and Thermal Diffusivity
THERMAL BASICS

Specific Heat, Volumetric Heat Capacity, and Thermal Diffusivity

April 4, 2024 Dr. Patrick Hopkins
Introduction to Thermal Metrology
THERMAL BASICS

Introduction to Thermal Metrology

March 27, 2024 Patrick Hopkins
High Thermal Conductivity and Thermal Boundary Conductance of Homoepitaxially Grown Gallium Nitride (GaN) Thin Films
RESEARCH PUBLICATIONS

High Thermal Conductivity and Thermal Boundary Conductance of Homoepitaxially Grown Gallium Nitride (GaN) Thin Films

October 14, 2021 Phys. Rev. Materials
Thermal Conductivity Measurements of Sub-Surface Buried Substrates by Steady-State Thermoreflectance
RESEARCH PUBLICATIONS

Thermal Conductivity Measurements of Sub-Surface Buried Substrates by Steady-State Thermoreflectance

June 19, 2021 Rev. Sci. Instrum.
High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films
RESEARCH PUBLICATIONS

High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films

April 28, 2021 ACS Nano
Spatially Resolved Thermoreflectance Techniques for Thermal Conductivity Measurements from the Nanoscale to the Mesoscale
RESEARCH PUBLICATIONS

Spatially Resolved Thermoreflectance Techniques for Thermal Conductivity Measurements from the Nanoscale to the Mesoscale

October 16, 2019 J. Appl. Phys.
A Steady-State Thermoreflectance Method to Measure Thermal Conductivity
RESEARCH PUBLICATIONS

A Steady-State Thermoreflectance Method to Measure Thermal Conductivity

February 28, 2019 Rev. Sci. Instrum.

We look forward to collaborating with you to understand your specific needs and provide tailored solutions for your project’s success.

*Required