Overcoming Challenges in Thermal Conductivity Measurement, from Soft TIMs to CVD Diamond
The thermal properties driving this may not match the assumptions, supplier data, or simulations you’ve been working from. And the tools available to you weren’t built to close that gap. Not at this length scale. Not in this architecture. Not close enough to the actual application to trust the result.
Not to replace the tools that work. To do the measurements no other tool was designed for:
You’re not only looking for a characterization tool.
You’re looking for the materials thermal intelligence to see what’s actually governing the thermal behavior of your material or device.
Whether you recognize your technology or the thermal challenge you’re facing, start where it feels most familiar. We’ll guide you to the relevant expertise, measurement capabilities, and solutions.
Recognize your technology. Find the materials, devices, and architectures where Laser Thermal helps engineers answer difficult thermal characterization questions.
Semiconductor
Thin films, advanced packaging, 3D integration, power devices, and wafer-level thermal characterization.
Advanced Materials
Novel materials, thermal interface materials, ceramics, polymers, composites, and functional materials.
Electronics Packaging
Packages, die attach, TIMs, substrates, and thermal performance across assembled electronic systems.
Aerospace & Defense
Coatings, composites, propulsion materials, lightweight structures, and extreme-environment applications.
Research & Academia
Measurement platforms for fundamental thermal transport research, materials science, and engineering innovation.
Recognize your engineering problem. Discover the thermal behaviors, material systems, and measurement challenges that conventional techniques often struggle to characterize.
Thin Films & Multilayer Structures
Measure thermal transport through thin films, coatings, multilayer stacks, and buried layers.
Thermal Interfaces
Separate interface resistance from bulk material properties across bonded layers, die attach, and thermal interface materials.
Anisotropic Materials
Characterize heat flow in materials whose thermal conductivity changes with direction.
Process-Induced Variability
Understand how deposition, growth, curing, sintering, additive manufacturing, and other processes change thermal behavior.
Localized Thermal Behavior
Reveal thermal variations, hot spots, defects, and non-uniformity through spatially resolved measurements.
Cutting-edge instrumentation, precise and advanced measurements, automated operation and analysis,
for materials and interfaces at the nano, micro, and macro scales

Thermal properties measurements & thermal property imaging from ultra thin-film to bulk materials. Explore FASTR

Thermal conductivity measurements for solids, liquids, pastes, gels, and foams. Explore TOPS

Accelerate your R&D and gain a competitive edge with our full-service thermal characterization testing laboratory. From advanced materials and thin films to solids and liquids, we provide rapid testing, use non-destructive methods and deliver precise measurements.
Our expert team and state-of-the-art instruments offer testing solutions, whether on a project basis or through bundled support packages.
Today’s performance limits increasingly live in architectures, where films are thinner, conductivities are higher, interfaces are buried, and heat flows differently by direction. Laser Thermal measures heat transport where it actually happens, at the right length scale and on the real sample. And it delivers results at the speed your progress demands.
Automated workflows remove the operator-dependent variables that make thermal data hard to defend, and measurement techniques designed for difficult materials capture what conventional approaches can miss. Engineering teams get results they can trust, and leadership gets the confidence to move projects forward.
Automation makes thermal characterization a routine step rather than a queue. Answers arrive while design choices are still open, reducing the time spent investigating unexpected performance or redesigning around incorrect assumptions.
When you can see what actually governs thermal performance, you can optimize the materials and processes others are still approximating, reduce technical risk, and bring differentiated products to market.
The logos below are only those we’re able to share publicly. Our broader customer base includes many of the leading semiconductor labs, national research laboratories, and power electronics manufacturers driving the industry forward.
Overcoming Challenges in Thermal Conductivity Measurement, from Soft TIMs to CVD Diamond
Thermal characterization matters more as AI accelerators intensify an existing package-level bottleneck
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Heat Beneath the Surface: Thermal Metrology for Advanced Semiconductor Materials and Architectures
Unveiling Phonon Contributions to Thermal Conductivity and the Applicability of the Wiedemann–Franz Law in Ruthenium and Tungsten Thin Films.
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Limitations and Advances in Optical Thermal Transport Measurements: Extremes in Properties, Length Scales, and Temperature
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Introduction to Thermal Metrology
High Thermal Conductivity and Thermal Boundary Conductance of Homoepitaxially Grown Gallium Nitride (GaN) Thin Films
Thermal Conductivity Measurements of Sub-Surface Buried Substrates by Steady-State Thermoreflectance
High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films
Spatially Resolved Thermoreflectance Techniques for Thermal Conductivity Measurements from the Nanoscale to the Mesoscale
A Steady-State Thermoreflectance Method to Measure Thermal Conductivity
Volumetric Heat Capacity Unit Conversion Calculator
Thermal Conductivity Unit Converter
Temperature Rise Calculators
Thermal Energy Unit Conversion Calculator
We look forward to collaborating with you to understand your specific needs and provide tailored solutions for your project’s success.