Frequency and Steady-State ThermoReflectance

FASTR - Thermal Metrology Instrument

The Only Complete Thermal Metrology Instrument

No optics tuning. No fitting games. No indirect method. No waiting. No guesswork.

Precise measurements with micron areal resolution

Wide thermal conductivity range (0.05 – 3,000 Wm^-1K^-1)

Full automation for unprecedented ease and speed

High fidelity data with +/-1% repeatability

Breakthrough Technology

FASTR combines Steady-State ThermoReflectance (SSTR) and Frequency-Domain ThermoReflectance (FDTR) in a compact, automated platform.

Unlike conventional free-space pump-probe systems that require complex optical alignment and exposed laser paths, FASTR integrates all active and passive optical components within a fully fiber-optic architecture. This design eliminates the need for prior optical expertise, enhances user safety, and drastically simplifies setup.

FASTR enables high-throughput, non-contact measurements of thermal conductivity, thermal boundary resistance, and volumetric heat capacity in thin films, multilayers, and bulk materials.

FASTR - wafer on motorized stage reflecting instrument

Measurable Thermal Properties by Sample Structure

	A. Bulk Material	B. Film + high thermal conductivity substrate	C. Film + low thermal conductivity substrate
In-Plane Conductivity	✔	✔ with limitations	✔
Cross-Plane Conductivity	✔	✔	✔ with limitations
Thermal Boundary Resistances	✔	✔ with limitations	✔ with limitations
Volumetric Heat Capacity	✔	✔ with limitations	✔ with limitations
Thermal Property Imaging	✔	✔	✔

The FASTR Advantage

The advantages of FASTR have proven essential to leaders in the semiconductor, power electronics, and thermal management industries. These users integrate the system to support the development of thin films and substrates engineered for thermal performance. In such applications, localized heat retention, dissipation, and interfacial resistance must be precisely understood to optimize layered systems.

Comprehensive thermal metrology

By capturing thermal behavior of advanced materials as they actually function, not just under idealized conditions, users validate thermal models and reduce uncertainty in real-world applications like semiconductor packaging, thin-film stacks, and next-generation coatings.
Supports in-plane, cross-plane, interfacial, and sub-surface configurations

Automation to speed discovery and throughput

The system features high levels of automation across the measurement stack, including:

Measure fast with automated workflow that spans acquisition, alignment, and interpretation (motorized stage & fully integrated software suite).
Access thermal properties without requiring optics expertise or post-processing.
Rely on motorized sample stages for precise spatial mapping and multi-site measurements

Precise measurements across all length scales

Micrometer-level spatial resolution (1–10 µm) and nanometer depth sensitivity (1 nm–10 µm) – Thermal conductivity range: 0.05 – 3,000 Wm^-1K^-1.
Measure with confidence: – ±1% repeatability and ±2% reproducibility.
Dual objective configuration enables additional flexibility, allowing researchers to characterize anisotropic, layered, or heterogeneous materials with high confidence.
Switch seamlessly between frequency-domain and steady-state modes to capture both thermal transport properties and interfacial behavior

Watch animated video

Watch our short animated video illustrating how our fully automated system drives ease-of-use and high throughput.

Read Supporting Peer-Reviewed Research

FASTR Specifications

Download the Specs Sheet

Performance Specifications
Features
Sample Requirements
Product Specifications

Thermal conductivity range

0.05 – 3,000 Wm^-1K^-1

Thermal Boundary Resistances (TBR)

4 m²KGW^-1 to 25 m²KGW^-1

Volumetric Heat Capacity

1 MJm^-3K^-1 to 4 MJm^-3K^-1

Thermal Property Imaging

10×10 µm to 150×150 mm

XY Travel

150×150 mm

Temperature Range

Room temperature up to 400 °C

Automation

Fully automated testing

Minimum Laser Spot Size / Lateral Resolution

2 µm

Standard Objective Lenses

10x and 20x

Maximum Thermal Penetration Depth

10 µm

Smallest Detectable Lateral Feature

100 nm

Sample Dimensions

Coupons – 5×5 mm to 25×25 mm
Wafers to 150 mm
Wafers to 300 mm (partial)

Thickness Range

Thermal resistance: ≥ 1 nm up to 300 nm*
*material dependent
Thermal conductivity: ≥ than 100nm

Sample Roughness

<10 nm RMS

Dimensions

31″W x 69″H x 32″D

Weight

500 lbs (nominal, varies by options)

Power Requirements

110/220 VAC, 50/60 Hz,
Power: 1 kW

Laser Safety

Class I and Class IIIb

Thermal Property Imaging

Local Resistance Mapping

Strained Released Structures

Wafer Homogeneity

How can we help your business?

Please contact us to see how our products and services can help you.

	Literature Value	TPS Measurement	SSTR-F Measurement
Pyroceram 9606	4.07 +/- .26	3.95	3.95 +/- 0.2
HPFS 7980	1.38	1.39	1.39 +/- 0.09