On-Demand Webinar: Unlocking Thermal Measurements in Thin Films
Designing reliable thermal measurements for thin films and bonded interfaces
As power densities rise and material stacks grow more complex, thermal performance is increasingly governed by effects that conventional tools struggle to resolve. Directional heat flow, dominant interfacial resistance, and weak signal sensitivity leave real engineering questions unanswered.
Watch this on-demand session to see what becomes measurable when advanced thermal metrology is applied to real-world thin film and bonded systems. Using aluminum nitride as a working example, Hans Olson, VP of Product Development at Laser Thermal, walks through separating cross-plane from in-plane thermal conductivity, extracting thermal boundary resistance in multilayer stacks, and characterizing high-conductivity films and sub-10-micron bondlines that fall outside the reach of bulk steady-state or laser flash methods.
What you’ll learn:
- How to isolate film conductivity from the substrate and separate intrinsic material properties from interfacial effects
- How to extract thermal boundary resistance across multilayer stacks and thin bondlines
- How to measure high thermal conductivity materials despite small temperature gradients and low signal-to-noise
- How anisotropy, multilayer architecture, and wafer-scale variation add complexity to measurement design
Who should watch:
TIM developers, substrate engineers, advanced packaging engineers, materials R&D teams, and reliability engineers looking for deeper visibility into heat transport across thin, high-performance material systems.
Attendees will leave with a clearer path to reproducible workflows for directional thermal property extraction, reduced engineering risk in interface-dominated systems, and access to measurements that were previously out of reach.
Access through IEEE Spectrum / WILEY
